| 摘要 |
A semiconductor device includes a lead frame. The lead frame has a chip mounting section and a plurality of leads. The chip mounting section has a base section, an insulation film covering the base section, a plurality of inter-connect sections, and a chip mounting area. The leads surround the chip mounting section. The semiconductor device also includes a first semiconductor chip having a plurality of first electrode pads. The semiconductor device also includes first bonding wires for connecting the first electrode pads to the inter-connect sections. The semiconductor device also includes a second semiconductor chip which has a cavity and a plurality of second electrode pads. The first semiconductor chip and the first bonding wires are received in the cavity. Second bonding wires connect the inter-connect sections exposed from the second semiconductor chip to the leads. Third bonding wires connect the second electrode pads to the leads. The semiconductor device also includes a sealing section.
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