发明名称 |
Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device |
摘要 |
The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer, forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.
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申请公布号 |
US2006134918(A1) |
申请公布日期 |
2006.06.22 |
申请号 |
US20050295471 |
申请日期 |
2005.12.07 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
FUJII GEN;MORISUE MASAFUMI;SHOJI HIRONOBU;MARUYAMA JUNYA;DAIRIKI KOUJI;AOKI TOMOYUKI |
分类号 |
H01L21/311;H01L21/302 |
主分类号 |
H01L21/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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