| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide supported multilayer ceramic printed circuit boards with a low two-dimensional shrinkage during firing. <P>SOLUTION: Passive components such as capacitors, resistors, and RF filters can be made by screen printing suitable inks onto green tapes and completed with conductive layers (14, 15) below and above component ink layers. A resultant green tape stack is then fired to form embedded capacitors. By bonding the green tape stack onto a metal support board substrate, a shrinkage in x and y dimensions is limited, so that the components can maintain close tolerances. When many green tape layers are stacked, an improvement in shrinkage is obtained when green tapes having a moderate amount of oxide fillers, e.g., less than about 15% by weight of the green tape composition, are interleaved with green tapes having higher amounts, e.g., above 25% by weight, of oxide fillers. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
