SHEET-LIKE PROBE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reliably prevent positional deviations between electrode structures and electrodes to be inspected due to temperature changes even in large-area wafers and circuit boards having electrodes to be inspected of extremely small pitch. SOLUTION: This sheet-like probe satisfies the following conditions (1)-(3); the condition (1) that H1=0.8×10-5to 8×10-5/K; the condition (2) that H2/H1<1; and the condition (3) that H3/H1<1 (wherein, the coefficient of linear thermal expansion of an insulating layer is H1; the coefficient of linear thermal expansion of a metal frame plate is H2; and the coefficient of linear thermal expansion of a ring-like supporting member is H3). A plurality of electrode structures 15 extended in thickness directions of the insulating layer 18 are arranged at a distance from one another in planar directions of the insulating layer 18 according to patterns corresponding to electrodes to be inspected of a target wafer. Bumper surface electrode parts 15a; plate-like back electrode parts 15b; and short-circuit parts 15c passed and extended in thickness directions of the insulating layer 18 are integrated. COPYRIGHT: (C)2006,JPO&NCIPI