| 摘要 |
<p>A phenolic novolac cured epoxy resin system, preferably utilized in electrical laminating applications, producing resins with a favorable balance of properties including relatively low D<SUB>k</SUB> values with comparable T<SUB>g</SUB> and time to delaminate values. The phenolic novolac curing agent is substituted with alkyl or aryl groups, which may be the same or different. The alkyl group is preferably a C<SUB>2</SUB> - C<SUB>20</SUB> group, more preferably a C<SUB>4</SUB> - C<SUB>9</SUB> group, and most preferably a butyl or octyl group. The aryl group is preferably a phenyl group. The curing agents of the invention and may be used separately, in combination with each other, or in combination with other curing agents.</p> |
