| 发明名称 |
A PRINTED CIRCUIT BOARD ASSEMBLY WITH IMPROVED BYPASS DECOUPLING FOR BGA PACKAGES |
| 摘要 |
<p>A printed circuit board assembly with improved bypass decoupling for BGA packages. In one embodiment, a capacitor may be interposed between a BGA package and a PCB within a perimeter of the contact pads that form a BGA footprint. The capacitor may have physical dimensions which allow a BGA package to be mounted such that there is no physical contact between the capacitor and the BGA.</p> |
| 申请公布号 |
EP1260121(B1) |
申请公布日期 |
2006.06.21 |
| 申请号 |
EP20000990918 |
申请日期 |
2000.11.21 |
| 申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
DRAKE, MICHAEL;TRESSLER, CHRIS;GUERRERO, EDWARD;SCHELLING, GREG;BENNETT, JOHN |
| 分类号 |
H05K1/18;H01L23/12;H01L23/64;H01L25/00;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
