发明名称 |
POLYMER PARTICLES, CONDUCTIVE PARTICLES AND AN ANISOTROPIC CONDUCTIVE PACKAGING MATERIALS CONTAINING THE SAME |
摘要 |
Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles. |
申请公布号 |
KR20060068599(A) |
申请公布日期 |
2006.06.21 |
申请号 |
KR20040107329 |
申请日期 |
2004.12.16 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
JUN, JUNG BAE;PARK, JIN GYU;LEE, JAE HO;BAE, TAE SUB |
分类号 |
C08J3/12;C08F20/06 |
主分类号 |
C08J3/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|