| 摘要 |
In electronic devices, heat removal is an important consideration of any device designer. Thermally conductive, high-temperature polyimide composites are disclosed herein which are generally useful as a dielectric layer in an electronic device, or a precursor metal-laminate, where the dielectric is layered on one side (or on both sides) with a metal. The polyimide composites of the present invention contain dispersed therein thermally conductive filler particles where the polyimide is derived in part from a polysiloxane diamine. These film composites have good mechanical elongation, good dielectric strength, and optionally good adhesivity (i.e. laminatability) (i.e. laminatability) and low modulus, while also possessing good thermal conductivity.
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