| 发明名称 |
MULTI-LEVEL SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3 . The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3. |
| 申请公布号 |
KR20060069231(A) |
申请公布日期 |
2006.06.21 |
| 申请号 |
KR20050059767 |
申请日期 |
2005.07.04 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KAWABATA TAKESHI;SATOU MOTOAKI;FUKUDA TOSHIYUKI;TSUDA TOSHIO;NOBORI KAZUHIRO;NAKATANI SEIICHI |
| 分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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