| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package in which a metal layer can be formed on electrode parts of a wiring pattern through electroplating, even if it is desired to have package dimensions made small or to make a package shape complicated. SOLUTION: A bridge member 50 for electrically which connects a wiring pattern 1 conducting with a lead frame and a wiring pattern 2 but not conducting with the lead frame together is brazed to electrode parts 11 and 12, a current is passed through the wiring pattern 1 with use of an electroplating rack and of the lead frame as a current-carrying electrode terminal, a current is also passed through the pattern 2 to form a metal film on the electrode parts 11 and 12 through electroplating. After the electroplating, a major part 50a of 5 of the bridge member 50 is removed from the electrode parts 11 and 12. Thereby automation of its manufacturing steps can be realized, and the manufacturing yield can be improved. Furthermore, since the package can be made small in its dimensions or its shape made complicated, semiconductor elements can deal with mounting in a package with high density. |
