METHOD FOR FORMING CU INTERCONNECTION OF SEMICONDUCTOR DEVICE,申请号KR20040105970-传众专利搜索

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发明名称	METHOD FOR FORMING CU INTERCONNECTION OF SEMICONDUCTOR DEVICE
摘要
申请公布号	KR20060068045(A)	申请公布日期	2006.06.21
申请号	KR20040105970	申请日期	2004.12.15
申请人	DONGBU ELECTRONICS CO., LTD.	发明人	YIM, TERESA
分类号	H01L21/28	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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