| 摘要 |
FIELD: chemical industry; microelectronics; methods of production and application of protective coatings. ^ SUBSTANCE: the invention is pertaining to the methods of production and industrial application of protective coatings, in particular, to the method of chemical nickel plating, which may be used for deposition of metal coatings on the microproducts in the microelectronics by chemical nickel plating. The method provides for preparation of the product surface, its acid etching, washing and the ultrasonic treatment (UST), activation of the surfaces of the products and their following chemical nickel-plating. At that after pickling the products are collected in the form of a pile with the capability of the mutual overlapping of their butt areas with the help of the device having the support surface, on which there is a mounted dowel bar or the shaft for the vertical pinning of the small products in the given position with the following moving the received assemblage into the working chamber for degreasing in the water solution of the washing agent in a combination with the UST. Further the assemblage is subjected to the treatment in the water solution of the surface active substance in combination with the UST and after washdown in the water with the UST the assemblage is subjected to sensitization in the solution containing ions of stannum. After that conduct activation in the solution containing ions of palladium and make nickel-plating. The technical result of the invention is the increased adhesion of the coating layer to the substructure, improvement of the quality of the coating due to provision of the solidity and continuity of the coating film and decrease of occurrence of the spoilage on the unauthorized areas. ^ EFFECT: the invention ensures the increased adhesion of the coating layer to the substructure, improved quality of the coating due to provision of the solidity and continuity of the coating film and decreased occurrence of the spoilage on the unauthorized areas. ^ 2 dwg, 1 ex, 1 tbl |
