发明名称 |
Multiple-ball wire bonds |
摘要 |
The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed on the connection pad that is contiguous with the first bump ball.
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申请公布号 |
US7064433(B2) |
申请公布日期 |
2006.06.20 |
申请号 |
US20040790969 |
申请日期 |
2004.03.01 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
WONG YAM MO;SOH JIN SIONG JOSHUA |
分类号 |
H01L23/48;H01L21/607;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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