| 摘要 |
The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section ( 1 ) for polishing a semiconductor wafer ( 6 ) and a cleaning section ( 10 ) for cleaning a polished semiconductor wafer, a receiving section ( 40 ) for supplying a semiconductor wafer ( 6 ) to be polished to the processing section and receiving a polished semiconductor wafer ( 6 ), and a cleaning chamber ( 20 ) disposed between the processing section and the receiving section and defined by partitions ( 102, 103 ) with shutters ( 22, 24 ) which separate the processing section and the receiving section from each other.
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