| 发明名称 |
SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS. |
| 摘要 |
<p>A solvent modified resin underfill material comprising a resin in combination with a filler of functionalized colloidal silica and solvent to form a transparent B-stage resin composition, which may then be cured to form a low CTE, high Tg thermoset resin. Embodiments of the disclosure include use as a wafer level filler, and an encapsulant for electronic chips.</p> |
| 申请公布号 |
MXPA06002522(A) |
申请公布日期 |
2006.06.20 |
| 申请号 |
MX2006PA02522 |
申请日期 |
2004.08.03 |
| 申请人 |
GENERAL ELECTRIC COMPANY. |
发明人 |
DAVID GIBSON III |
| 分类号 |
C01B33/14;C08K3/34;C08K9/06;C08L63/00;C09C1/30;H01L21/56;H01L23/29;(IPC1-7):C01B33/14 |
主分类号 |
C01B33/14 |
| 代理机构 |
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