METHOD FOR LEAD-FREE SOLDERING OF SEMICONDUCTOR CHIP TO CASE

摘要

FIELD: electronic engineering; manufacture of semiconductor devices. ^ SUBSTANCE: proposed method that can be used for assembling silicon chips within semiconductor device case using lead-free solders for their fixation involves covering of chip surface to be soldered with zinc and its soldering to tin-covered base of case. Additionally applied to zinc film is tin-bismuth coat having bismuth content of 0.4 - 0.9%. Such lead-free soldering method improves tin wettability of chip surface at soldering temperature and reduces area of poor solder penetration. ^ EFFECT: enhanced corrosion resistance of chip surface and reliability of semiconductor device. ^ 1 cl