发明名称 CVD process capable of reducing incubation time
摘要 A metal CVD process includes a step (A) of introducing a gaseous source material containing a metal carbonyl compound into a process space adjacent to a surface of a substrate to be processed in such a manner that the metal carbonyl compound has a first partial pressure, and a step (B) of depositing a metal film on the surface of the substrate by introducing a gaseous source material containing the metal carbonyl compound into the process space in such a mater that the metal carbonyl compound has a second, smaller partial pressure. The step (A) is conducted such that there is caused no substantial deposition of the metal film on the substrate.
申请公布号 US7063871(B2) 申请公布日期 2006.06.20
申请号 US20030617819 申请日期 2003.07.14
申请人 TOKYO ELECTRON LIMITED 发明人 YAMASAKI HIDEAKI;HATANO TATSUO;MATSUDA TSUKASA;IKEDA TARO;NAKAMURA KAZUHITO;MATSUZAWA KOUMEI;KAWANO YUMIKO;TACHIBANA MITSUHIRO
分类号 C23C16/16;H01L21/28;H01L21/285 主分类号 C23C16/16
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