发明名称 |
METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE |
摘要 |
<p>The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.</p> |
申请公布号 |
KR100593943(B1) |
申请公布日期 |
2006.06.20 |
申请号 |
KR20050036572 |
申请日期 |
2005.04.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, YOUNG KI;CHOI, SEOG MOON;KIM, YONG SIK;SHIN, SANG HYUN |
分类号 |
H01L33/48;H01L33/58;H01L33/62;H01L33/64 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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