发明名称 Semiconductor die with high density offset-inline bond arrangement
摘要 A pad pattern of a die includes first and second sets of elongated pads. The first set of elongated pads is interleaved with the second set of elongated pads. Each of the elongated pads has a bond pad area and a probe pad. Each bond pad area has a first constant width along a substantial portion thereof. Similarly, each probe pad area has a second constant width along a substantial portion thereof. The first constant width is greater than the second constant width. Each elongated pad in the first set has a first orientation. Similarly, each elongated pad in the second set has a second orientation, opposite the first orientation.
申请公布号 US7064450(B1) 申请公布日期 2006.06.20
申请号 US20040842756 申请日期 2004.05.11
申请人 XILINX, INC. 发明人 EGHAN ABU K.;LI RICHARD C.;WU XIN X.
分类号 H01L23/48 主分类号 H01L23/48
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