Manufacturing tool for wafer level package and method of placing dice

摘要

A manufacturing method of placing dice for a wafer level package comprises placing a plurality of dice on an elastic material, which is formed on a first base, and the elastic material of the present invention has viscosity in a first condition to adhere the plurality of dice; forming an adhesive material on a second base; adhering the plurality of dice on the adhesive material of the second base; and stripping the plurality of dice from the elastic material in a second condition.