| 摘要 |
A memory module has a module board having a main surface. A plurality of memory chips is arranged on the main surface of the module board. Each memory chip has two main surfaces extending between a first end face and a second end face of the memory chip, first mounting sites mounted to the main surface of the module board, and second mounting sites spaced apart from the first mounting sites and mounted to support sites spaced apart from the module board, so that a distance between the first end face and the module board is greater than a distance between the second end face and the module board. A circuit chip suited for such a memory module has terminals for connecting a circuitry of the circuit chip to terminals on the motherboard. Moreover, conductive structures are provided on a surface of the circuit chip for connecting terminals of another circuit chip to terminals on the motherboard.
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