发明名称 Film carrier tape for mounting electronic devices thereon
摘要 A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
申请公布号 US7060364(B2) 申请公布日期 2006.06.13
申请号 US20030745403 申请日期 2003.12.23
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 KATAOKA TATSUO;AKASHI YOSHIKAZU
分类号 B32B15/00;B32B15/04;H05K1/00;H05K3/24;H05K3/38 主分类号 B32B15/00
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