发明名称 |
Film carrier tape for mounting electronic devices thereon |
摘要 |
A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
|
申请公布号 |
US7060364(B2) |
申请公布日期 |
2006.06.13 |
申请号 |
US20030745403 |
申请日期 |
2003.12.23 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
KATAOKA TATSUO;AKASHI YOSHIKAZU |
分类号 |
B32B15/00;B32B15/04;H05K1/00;H05K3/24;H05K3/38 |
主分类号 |
B32B15/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|