发明名称 CMP pad having an overlapping stepped groove arrangement
摘要 A polishing pad ( 104, 300 ) having an annular polishing track ( 152, 320 ) and a plurality of groups ( 160, 308 ) of grooves ( 112, 304 ) repeated circumferentially about the rotational center ( 128 ) of the pad. The plurality of grooves in each group are arranged along a trajectory ( 164, 312 ) in an offset and overlapping manner so as to provide a plurality of overlapping steps ( 172, 316 ) within the annular polishing track. The groups may be arranged in spaced-apart or nested relation with one another.
申请公布号 US7059949(B1) 申请公布日期 2006.06.13
申请号 US20040012396 申请日期 2004.12.14
申请人 ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 发明人 ELMUFDI CAROLINA L.;MULDOWNEY GREGORY P.
分类号 B24D11/00;B24D99/00 主分类号 B24D11/00
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