| 发明名称 |
Multi-surface IC packaging structures and methods for their manufacture |
| 摘要 |
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
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| 申请公布号 |
US7061096(B2) |
申请公布日期 |
2006.06.13 |
| 申请号 |
US20040947686 |
申请日期 |
2004.09.23 |
| 申请人 |
SILICON PIPE, INC. |
发明人 |
FJELSTAD JOSEPH C;SEGARAM PARA K.;OBENHUBER, LEGAL REPRESENTATIVE INESSA;GRUNDY KEVIN P. |
| 分类号 |
H01L29/40;H01L;H01L21/56;H01L23/31;H01L23/48;H01L23/495;H01L23/498 |
主分类号 |
H01L29/40 |
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