Electronic package with optimized lamination process

摘要

An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T_1MIN and a maximum temperature T_1MAX. T_1MAX constrains the ductility of the first dielectric layer to be at least D₁ following the laminating. T_1MAX depends on D₁ and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T_2MIN and a maximum temperature T_2MAX. T_2MAX constrains the ductility of the second dielectric layer to be at least D₂ following the laminating. T_2MAX depends on D₂ and on a second dielectric material comprised by the second dielectric layer.