摘要 |
A diffusion furnace of semiconductor manufacturing equipment is cleaned efficiently with a cleaning gas (ClF<SUB>3</SUB>) by using an auxiliary cleaner. The auxiliary cleaner is inserted into an inner tube of the wafer diffusion furnace. The auxiliary cleaner has a cylindrical body that occupies a central region of the interior of the furnace but is spaced apart from an inner wall surface of the inner tube. Accordingly, the gas is confined to a peripheral region adjacent the inner wall surface. As a result, a relatively small amount of the cleaning gas is comsumed during the cleaning process.
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