发明名称 |
Packaging method of plasma display panel modules |
摘要 |
A panel module includes a panel in which a pair of substrates at least having a transparent front substrate is disposed facing each other with a discharge space in between and electrodes are disposed on substrates; a chassis for holding this panel; and a display driving circuit for applying a signal to the panel attached to the chassis for display. A resin front protective cover having substantially the same dimensions as a front frame of a finished plasma display device is provided on a periphery of the panel module for protecting the periphery of the panel module.
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申请公布号 |
US7059473(B2) |
申请公布日期 |
2006.06.13 |
申请号 |
US20020116747 |
申请日期 |
2002.04.05 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
WATANABE HIROSHI;TOUGO HIDENORI;SASAKI SHOZO |
分类号 |
B65D85/48;B65D85/68;B65D5/50;B65D77/02;B65D77/26;B65D81/02;B65D81/107;B65D81/113;B65D85/38;B65D85/86;G09F9/00;H01J17/49;H05K7/00 |
主分类号 |
B65D85/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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