发明名称 |
Solid-state imaging device and method of manufacturing the same |
摘要 |
A solid-state imaging device that achieves a reduction in variations appearing on a reproducing screen is provided. The solid-state imaging device includes a plurality of pixel cells that are laid out in matrix form on a semiconductor substrate and a driving unit that is provided to drive the plurality of pixel cells. Each of the plurality of pixel cells includes a photodiode, a MOS transistor, and an element isolating portion 2 that is formed so that the photodiode and the MOS transistor are isolated from each other. The element isolating portion 2 is formed of a STI (Shallow Trench Isolation) that is a grooved portion of the semiconductor substrate. In the semiconductor substrate 7 , a STI leakage stopper 1 in which an impurity of a conductive type opposite to a conductive type of source/drain regions in the MOS transistor is introduced is formed to enclose side walls and a bottom face of the element isolating portion 2.
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申请公布号 |
US7060960(B2) |
申请公布日期 |
2006.06.13 |
申请号 |
US20030727676 |
申请日期 |
2003.12.04 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OHTA SOUGO;UCHIDA MIKIYA;MATSUNAGA YOSHIYUKI |
分类号 |
H01L27/146;H03F3/08;G01J1/44;H01L21/76;H01L21/762;H01L27/00;H01L31/00;H01L31/10;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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