发明名称 Solid-state imaging device and method of manufacturing the same
摘要 A solid-state imaging device that achieves a reduction in variations appearing on a reproducing screen is provided. The solid-state imaging device includes a plurality of pixel cells that are laid out in matrix form on a semiconductor substrate and a driving unit that is provided to drive the plurality of pixel cells. Each of the plurality of pixel cells includes a photodiode, a MOS transistor, and an element isolating portion 2 that is formed so that the photodiode and the MOS transistor are isolated from each other. The element isolating portion 2 is formed of a STI (Shallow Trench Isolation) that is a grooved portion of the semiconductor substrate. In the semiconductor substrate 7 , a STI leakage stopper 1 in which an impurity of a conductive type opposite to a conductive type of source/drain regions in the MOS transistor is introduced is formed to enclose side walls and a bottom face of the element isolating portion 2.
申请公布号 US7060960(B2) 申请公布日期 2006.06.13
申请号 US20030727676 申请日期 2003.12.04
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 OHTA SOUGO;UCHIDA MIKIYA;MATSUNAGA YOSHIYUKI
分类号 H01L27/146;H03F3/08;G01J1/44;H01L21/76;H01L21/762;H01L27/00;H01L31/00;H01L31/10;H04N5/335;H04N5/369;H04N5/374 主分类号 H01L27/146
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