发明名称 Semiconductor device using SOI device and semiconductor integrated circuit using the semiconductor device
摘要 A semiconductor device includes a semiconductor layer provided on a semiconductor substrate with an insulating film interposed therebetween. A gate electrode is provided on the semiconductor layer with a gate insulating film interposed therebetween, and a pair of source/drain regions are formed in the semiconductor layer so as to hold a body region under the gate electrode therebetween. A control section supplies voltages to the source/drain regions. The control section supplies the body region in an OFF state and ON state with a first voltage and a second voltage different from the first voltage, respectively. The second voltage is set such that a potential of the body region in the OFF state is substantially the same as a potential of the body region in the ON state.
申请公布号 US7061049(B2) 申请公布日期 2006.06.13
申请号 US20020166389 申请日期 2002.06.11
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KAWANAKA SHIGERU
分类号 H01L27/01;H01L27/12;H01L29/786 主分类号 H01L27/01
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