Dicing/die-bonding film, method of fixing chipped work and semiconductor device

摘要

A dicing/die-bonding film including a pressure-sensitive adhesive layer ( 2 ) on a supporting base material ( 1 ) and a die-bonding adhesive layer ( 3 ) on the pressure-sensitive adhesive layer ( 2 ), wherein a releasability in an interface between the pressure-sensitive adhesive layer ( 2 ) and the die-bonding adhesive layer ( 3 ) is different between an interface (A) corresponding to a work-attaching portion ( 3 a) of the die-bonding adhesive layer ( 3 ) and an interface (B) corresponding to a part or a whole of the other portion ( 3 b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.