发明名称 HEAT TREATING DEVICE AND HEAT TREATING METHOD
摘要 A heat treating device which comprises a reaction vessel, and a holder received in the reaction vessel for holding a number of objects to be treated. The lower end of the reaction vessel is closed by a cover body, and a heat insulation unit is installed between the cover body and the holder. Installed on the upper surface of the heat insulation unit is a heat generation body unit consisting of a resistance heat generation wire of high purity carbon material sealed in a quartz plate, with a heat insulation body installed on the underside of this heat generation body unit. The heat insulation unit is fixed to the cover body, a rotatable shaft for rotating the holder extends through the center of the heat insulation unit, and a power feeding path member for feeding power to the heat generation body unit is drawn outwardly of the heat insulation unit.
申请公布号 KR20060064030(A) 申请公布日期 2006.06.12
申请号 KR20067010029 申请日期 2006.05.23
申请人 TOKYO ELECTRON LIMITED 发明人 SAITO TAKANORI;OSANAI HISAEI;MAKIYA TOSHIYUKI
分类号 H01L21/205;H01L21/22;C23C16/455;C23C16/46;H01L21/00;H01L21/31 主分类号 H01L21/205
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