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发明名称
LIQUID EPOXY RESIN COMPOSITION FOR PACKAGING ELECTRONIC COMPONENT
摘要
申请公布号
KR20060062095(A)
申请公布日期
2006.06.12
申请号
KR20040100822
申请日期
2004.12.03
申请人
SK CHEMICALS. CO., LTD.
发明人
BAE, JONG GWON;KIM, DO HYUN
分类号
C08L63/00
主分类号
C08L63/00
代理机构
代理人
主权项
地址
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