DISPLAY APPARATUS AND MANUFACTURING METHOD OF DISPLAY APPARATUS

摘要

PROBLEM TO BE SOLVED: To effectively perform connection of a COG terminal for IC chip mounting.

SOLUTION: An interlayer insulating film 12 on a connection wire 10 connected to a data line and consisting of a metal having a high melting point is removed to form an aperture. A terminal underlayer 20 consisting of a metal having a high melting point is formed at the part where the connection wire 10 is exposed and a COG terminal layer 22 consisting of aluminum or an aluminum alloy is further formed thereon. A vamp 26a and an ACF 24 can be effectively connected by forming a terminal part by using these materials.

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