| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin-type semiconductor device and the manufacturing method thereof whose manufacturing cost can be lowered. <P>SOLUTION: The semiconductor device 1 has a semiconductor chip 2 having a first surface 2a provided with electrodes and having a second surface 2b opposed to the first surface and having a plurality of side surfaces for connecting thereby the first and second surfaces with each other, and has a plurality of electrode plates 4 in each of which its first surface 4a is connected with the first surface of the semiconductor chip via each insulator 7 and its first portion 5 is made thin by removing partially by a predetermined thickness the portion of its second surface 4b opposed to its first surface 4a and its second portion 6 is made thicker than its first portion 5, and has each conductive wire 9 for connecting each second surface 4b of each first portion 5 with each electrode of the semiconductor chip 2, and has a sealant made of an insulating resin 3 for covering therewith the first surface of the semiconductor chip, the first portions of the electrode plates, and the wires. Further, the second surfaces of the second portions of the electrode plates are exposed from the sealant to the external. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
