| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate manufacturing apparatus capable of forming a thin substrate with a reduced cutting allowance from an ingot, and a substrate manufacturing method. <P>SOLUTION: Both of a laser device 3 and a condensing lens 5 are positioned by a moving device so that the forcus point of a laser beam is positioned in the vicinity of the center of the processing surface of the ingot 1. Then, the laser device 3 and the condensing lens 5 are moved to the outside in the diametric direction of the ingot 1 at a predetermined speed while rotating a turntable 2, on which the ingot 1 is placed, in a directionαto move the focus point of the laser beam on a processing surface in a whirled state. Thereafter, a wafer 7 is cut off from the ingot 1 by a vacuum chuck 8. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
