| 摘要 |
A frame is provided for packaging a microelectronic device. The frame is formed from a unitary member, electrically conductive device-attachable pads, and terminals in electrical communication with the device-attachable pads. The unitary member includes a base section, first and second wall sections each extending from the base section, and first and second roof surfaces supported by the first and second wall sections, respectively. The base section has an interior surface having electrically conductive device-attachable pads thereon. The terminals are typically located on the first and second roof surfaces. Optionally, first and second cantilevered sections extend from the first and second wall sections, respectively, toward each other. The frame is typically stackable. Also provided are microelectronic packages and methods for producing microelectronic packages.
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