发明名称 METHOD AND SYSTEM FOR FORMING WIRING, AND ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of forming wiring which can surely form the wiring in a flexible board using a drop injection method. <P>SOLUTION: The method of forming the wiring in the flexible board 1 comprises a process of fixing the flexible board 1 to a support 5, and a process of carrying the flexible board 1 and the support 5 together and performing a prescribed treatment on the flexible board 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006147646(A) 申请公布日期 2006.06.08
申请号 JP20040331961 申请日期 2004.11.16
申请人 SEIKO EPSON CORP 发明人 KUROSAWA HIROFUMI
分类号 H05K3/10;B05D1/26;H01L21/288;H01L21/3205;H01L21/60 主分类号 H05K3/10
代理机构 代理人
主权项
地址