发明名称 ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT, AND MODULE WITH ELECTRONIC COMPONENT MOUNTED THEREIN
摘要 PROBLEM TO BE SOLVED: To make electronic components hardly come off a circuit board against shocks exerted on the electronic components when they are mounted on the circuit board while the thickswise size of the circuit board is possibly reduced. SOLUTION: The edge of the notch 22 of a circuit board 12 is fitted into a groove 20 formed in an electronic component 10 to insert the electronic component 10 to pierce the notch 22 of the board 12, and the flexure 14A of the terminal 14 of the electronic component 10 is soldered to a wiring pattern 16 on the circuit board 12, thus electrically connecting and fixing the electronic component 10 to the circuit board 12. Mounting the electronic component 10 in the form of piercing the circuit board 12 from the front to back causes to protrude over the front and back of the circuit board 12, this allowing the size of a module to be reduced by the thick portion of which is formed by mounting the electronic components 10 on the circuit board 12, compared with that at mounting the electronic components 10 on the front or back of the circuit board 12. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006147938(A) 申请公布日期 2006.06.08
申请号 JP20040337792 申请日期 2004.11.22
申请人 FUJI PHOTO FILM CO LTD 发明人 SAWAHARA SHINGO;TAMAYAMA HIROSHI;NOSE SHUJI
分类号 H05K1/18;H01L23/50 主分类号 H05K1/18
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