发明名称 |
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE HOLDING APPARATUS |
摘要 |
The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus (1) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder (11) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder (11). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism (303a) for moving the rollers (20). |
申请公布号 |
KR20060061816(A) |
申请公布日期 |
2006.06.08 |
申请号 |
KR20067002591 |
申请日期 |
2006.02.07 |
申请人 |
EBARA CORPORATION |
发明人 |
YAMADA KAORU;SAITO TAKAYUKI;YABE SUMIO;ITO KENYA;KAMEZAWA MASAYUKI;SEKI MASAYA;KATAKABE ICHIRO;INOUE YUKI |
分类号 |
H01L21/02;B08B1/04;B08B3/02;C23C18/16;C25D7/12;H01L21/00;H01L21/304;H01L21/306 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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