发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE HOLDING APPARATUS
摘要 The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus (1) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder (11) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder (11). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism (303a) for moving the rollers (20).
申请公布号 KR20060061816(A) 申请公布日期 2006.06.08
申请号 KR20067002591 申请日期 2006.02.07
申请人 EBARA CORPORATION 发明人 YAMADA KAORU;SAITO TAKAYUKI;YABE SUMIO;ITO KENYA;KAMEZAWA MASAYUKI;SEKI MASAYA;KATAKABE ICHIRO;INOUE YUKI
分类号 H01L21/02;B08B1/04;B08B3/02;C23C18/16;C25D7/12;H01L21/00;H01L21/304;H01L21/306 主分类号 H01L21/02
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