| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the method of manufacturing a lead frame which can secure a high dimensional accuracy for steps in an exposed part of leads, can form high-strength leads, and can also form a wide exposed surface for heat dissipation in the lead frame as a semiconductor device; and also to provide the lead frame. <P>SOLUTION: The semiconductor device comprises a semiconductor chip, the lead frame having a plurality of leads electrically connected to the semiconductor chip, and a sealing resin for resin-sealing the semiconductor chip and the lead frame with part of the leads exposed as connectable external terminals on the bottom surface. The method of manufacturing the lead frame used in the semiconductor device includes a groove formation process (S1) wherein a groove is formed by pressing a lead frame material, so that part of the leads may be exposed on the bottom surface of the semiconductor device after the steps are formed in the leads and the lead frame is manufactured as the semiconductor device. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
