| 摘要 |
PROBLEM TO BE SOLVED: To conduct heat treatment for a substrate being transported along a transportation route while shutting communication with outside. SOLUTION: In a baking device main body 20 which is installed while the transportation route 11 is enclosed, an upper stream side substitute chamber V1 for substituting inside gas in a state that the substrate B introduced from outside via an inlet 231 is accepted, a treatment chamber V2 for conducting a baking treatment by introducing low oxygen gas to the substrate B fed from the upper stream side substitute chamber V1 via an introducing port 265 and a lower stream side substitute chamber V3, with an outlet 241 for discharging the substrate at its lower stream end, for substituting inner gas in a state that the substrate B derived from a derivation port 268 of the treatment chamber V2 is accepted are sequentially formed from an upper stream side to a lower stream side. A shutter device 50 for suppressing distribution of gas is provided at the inlet 231 of the upper stream side substitute chamber V1 and the outlet 241 of the lower stream side substitute chamber V3. A gate valve device 60 for shutting distribution of gas is provided at the introducing port 265 and the derivation port 268 of the treatment chamber V2. COPYRIGHT: (C)2006,JPO&NCIPI
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