| 摘要 |
Systems and methods for providing input/output signal termination with reduced power dissipation on an integrated circuit die are invented and disclosed. One embodiment comprises a method for reducing on die power dissipation while providing on die signal termination that includes receiving a termination reference voltage at a first input of an integrated circuit die, applying the first signal to a single termination element coupled in series between the first input and a receiver input to generate a common node reference voltage, receiving a second signal at a second input of the integrated circuit die, and coupling the second signal to the receiver input.
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