| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip chip ball grid array package structure capable of preventing the phenomenon that stress is increased by the deviation of a position induced by the change of a temperature after connecting a solder ball and a printed circuit board and the solder ball is cracked. <P>SOLUTION: The package structure comprises: a base provided with a plurality of leads; a plurality of solder bumps electrically connected to the leads; a patterned first elastic dielectric layer covering the partial area of a protective layer on a flip chip; a conductive layer formed on the first elastic dielectric layer and provided with a refracted pattern generated by the pattern of the first dielectric layer, where the refracted pattern is partially attached on a protective layer and the patterned first elastic dielectric layer; and a second elastic dielectric layer covering the dielectric layer and forming a plurality of openings, where the openings are provided with the plurality of solder bumps coupled to the plurality of leads. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
