| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of reducing the number of components without an evil due to a transfer mold, and permitting the application of optical elements having various configurations and properties. <P>SOLUTION: In the optical semiconductor device; a luminous element 21 and a photo detector 22, which are arranged on a substrate 1, are covered by a completely cured resin 32 having transparency. Further, a polarizer 41, a beam splitter 42, and a prism 45 are retained and fixed by the completely cured resin 32. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
