发明名称 CIRCUIT MODULE BODY AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To airtightly seal and mount a functional element body in a function element storage space formed in a layer by an inexpensive material and a simple configuration. SOLUTION: The function element body storage space 4 is formed inside the laminate between first and second wiring boards 2, 3 for sealing and mounting the function element body 5. A via hole 13, which communicates with the function element body storage space section 5 directly below the function element body 5, is filled with resin 15. A via 12 is formed which is closed with metal plated layers 16, 17. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006147726(A) 申请公布日期 2006.06.08
申请号 JP20040333694 申请日期 2004.11.17
申请人 SONY CORP 发明人 MIYAZAKI HIROHITO;OYA YOICHI;OKUHORA AKIHIKO
分类号 H01L23/02;H03H9/25 主分类号 H01L23/02
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