| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel method of manufacturing a high density printed circuit board capable of removing a core insulating layer having an inevitable thickness. SOLUTION: An insulator capable of being patterned by ultraviolet rays is coated on one side of copper foil, the insulator is patterned using the ultraviolet rays, a circuit pattern is formed on the insulator by electrolytic plating, an insulating layer is laminated on the circuit pattern, and via holes and circuit patterns are formed on the insulating layer and the other side of the copper foil. COPYRIGHT: (C)2006,JPO&NCIPI |
