| 摘要 |
PROBLEM TO BE SOLVED: To provide an interlayer connecting device which ensures electrical connection between layers and, in which a substrate can be worked in a short time. SOLUTION: The interlayer connecting device 100 connects the layers of a multilayered substrate 14 having many via holes 50 to one another. The substrate 14 is arranged in a vacuum vessel 11, and an aerosol generating chamber 20 is connected to the vacuum vessel 11. A gas introducing section 80 supplies gas to the aerosol generating chamber 20 and controls the supplied gas. A fine metallic particle introducing section 82 introduces fine conductive metallic particles which bury the via holes 50 to the aerosol generating chamber 20, and controls the introduced particles. A nozzle array 24 in which nozzles 25 corresponding to arrangements of the via holes 50 are formed is arranged in the connection between the aerosol generating chamber 20 and a vacuum chamber. COPYRIGHT: (C)2006,JPO&NCIPI |
