| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device mounting an IC on a flexible base material having inner leads and a wiring pattern related to the inner leads in a mounting region by a simple method at a lower cost, and also to provide a semiconductor device. <P>SOLUTION: The wiring pattern 122 is arranged in the mounting region 12 of the flexible wiring base material 11 in addition to a plurality of at least the inner leads 121. The wiring pattern 122 has a connecting form in the mounting region 12 in which the specified inner leads 121 are connected mutually. The bump electrode 15 side of the bare chip IC 14 is opposed to the mounting region 12, and each of bump electrodes 15 is metal-joined with the corresponding inner leads 121 or the wiring pattern 122. A liquefied resin 17 is made to flow between the IC 14 and the mounting region 12, and the protective form of the IC 14 in the mounting region 12 is manufactured through a curing process. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
