| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing solution useful for preferentially removing a barrier material, while suppressing erosion of an insulating material under the presence of a nonferrous wiring metal. <P>SOLUTION: The polishing solution includes 0-20 wt.% of an oxidizer, an inhibitor for reducing the removal rate of the nonferrous wiring metal, an ammonium salt, 0.1-50 wt.% of silica containing 0.001-1 ppm of sodium and 0.001-1 ppm of potassium, and the balance water. The polishing solution has a pH lower than by an inorganic acid that is used as a titrant. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
