发明名称 REMOVING METHOD OF FOULING ON SUBSTRATE SURFACE, REMOVING TREATMENT LIQUID AND REMOVING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a removing a treatment liquid, a treatment method and a removing device of an organic system fouling on a substrate surface capable of removing even a resist film hardened and denaturalized by high-concentration ion implantation at room temperature and provided with a multi-repeatable treatment capacity using environment-friendliness and ozone regeneration at almost the same level of ethylene carbonate (EC) treatment. SOLUTION: (1) The removing method of the organic system fouling on the substrate surface, wherein the fouling is exfoliated by contacting the treatment liquid containing a mixed solvent composed of EC of a weight ratio 85/15 to 55/45 andγ-butyrolactone (GBL) with the substrate having the organic system fouling on the surface.(2) The removing treatment of the organic system fouling, wherein a reaction product of the mixed solvent and ozone and a reaction product of the organic system fouling and ozone are contained in 0 to 5 weight% in total and a residue is the mixed solvent.(3) The removing device of the organic system fouling, wherein the system has a treatment liquid introducing means, a fouling contacting means, a treatment liquid circulating means and an ozone containing gas contacting means. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006148071(A) 申请公布日期 2006.06.08
申请号 JP20050290678 申请日期 2005.10.04
申请人 PUREX:KK;UMS:KK 发明人 MURAOKA HISASHI;NOZAKI TADASHI
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
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